The Tech Group to Speak at ETP Conference

July, 1 2003

The Tech Group is pleased to announce it will be participating in the Engineering Thermoplastics 2003 - Opportunities Through Technology Conference and Exhibition (ETP).

The exposition and conference will be held September 29 - 30, 2003 at The Hyatt Regency O'Hare Hotel in Chicago, Illinois.

Conference attendees will learn the latest innovations in materials, processes and tooling, while networking with customers, prospects, colleagues and suppliers.

The use of thermoplastic elastomers by design engineers has been an integral part of product design for years. Until recently, the configurations and features were somewhat limited due to cost constraints and manufacturability. The advent of multi-component molding has changed the landscape dramatically, providing an array of manufacturing options and product geometries that not only meet the demands of the marketplace, but create demand as well. Join Tom Podesta, Vice President of Sales for The Tech Group, in exploring multi-component options to enhance your next product design.